IEEE Ottawa Section - Proposed Video Course on Microelectronic Failure Analysis
with Breakout of lectures into Mini-courses  -  Last updated 17 January 2000

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Plan summary:

• early Nov 99 - distribute email questionnaire. Reply by 15 Nov and get 20% discount
• late Nov 99 - Review budget and seek permission to proceed; order videos.
• Jan 2000 - publicize activity for further enrollment
• Feb- April 2000 - Present course, probably daytime - 4/5 sessions per day, probably same day on selected weeks.

Circuits & Devices Videos - Microelectronic Failure Analysis
Sponsored by the University of New Mexico

During the Fall Semester of 1997, thirty 75-minute lectures in Microelectronic Failure Analysis were given at the University of New Mexico (UNM) and transmitted via satellite to manufacturing sites across the USA; it is now available on videotape through the IEEE. The course was designed and delivered by experienced, recognized persons who are leaders in failure analysis practice, development, and conference leadership. This produces a depth and breadth of coverage that a single person could not do. Experts from industry conceived the course not only to fill a void in university teaching of failure analysis but also to allow strong participation. These lectures were a part of a graduate course: a joint venture of the UNM, Sandia National Labs, and the Product Analysis Forum (PAF) of Sematech. Many of the listed speakers also give tutorials at the ATM-sponsored ISTFA (International Symposium for Testing and Failure Analysis); this is the pre-eminent annual conference for microelectronics failure analysis.

Managers and practicing engineers within failure analysis departments will benefit greatly from this extensive course. Viewers should have a basic knowledge of transistor devices (MOSFET) and IC technology. A background in IC manufacturing is helpful, but not essential. This set consists of all thirty lectures on videotape, presentation notes. The textbook is Microelectronic Faiure Analysis Desk Reference, 3rd Edition (ASM International, 1993) - 450pp; about $150US. The 4th Edition is now available.

• Technical Foundations of Failure Analysis
• Etching: wet, dry, Focused Ion Beam analysis
• Imaging: optical, e-beam, Transmission Electron Microscopy, Electron- & Optical-Beam Induced Current thermal, & backside measurement
• Recent Techniques: Charge Induced Voltage Alteration, RCI, leakage currents - IDDt
• Management and Business of Failure Analysis

From this video you will learn

• The technical foundations of failure analysis: test, reliability, design impact, packaging, and fabrication
• Selection of etch and delayering techniques
• How to select one of the many imaging techniques
• New techniques, used by leading edge companies, for analysis of deep submicron ICs having up to seven layers of metal

  Note - Summary biographical notes for the presenters is given below.

A - Introduction & Management Issues (2+2 or one full day)

• Introduction: Course Mechanics, Course Overview, etc.; overview of how FA is a critical part of the IC industry; business value of FA; relationship of FA to design, test, process, Q&R, etc. - Ted Dellin 01
• The Failure Analysis Process: decision-making aspects, etc. - Dave Vallett 02
• Overview of FA Process in Industry: big picture, business perspective, where does FA fit in company, cost, economics - Sudhakar Kudva 30
• Business aspects of FA: lab models, cost of ownership, etc. - Dick Ross 28

G - Design, Fabrication and Failure Modes of CMOS ICs (2+2 or one full day)

• CMOS IC fabrication: fab (etch, photolithography, implantation, etc.) and physical (layout, etc.) aspects. Steve Hersee 03 
• CMOS IC electrical testing: testing, characterization, and diagnosis; test approaches including functional, stuck-at, scan, Built-in Sytem Test, delay, IDDQ, etc.- Ken Butler 04 
• CMOS IC Design: design and electrical aspects; design for diagnosis and FA. - Doug Josephson 05 
• CMOS IC Quality and Reliability: sources of failure yield, reliability, field, etc.;  why FA approach depends on source - Steve Hersee and Chuck Hawkins 06
   

C - Selected Failure Modes of Microelectronic Devices

• Electrical Failure Modes and Models: electrical behavior of dominant CMOS defects and failure mechanisms and relationship to common models.- Chuck Hawkins 07
• Physical failure modes and mechanisms: dominant types (oxide breakdown, bridging shorts, interconnect opens, EM). - Bill Miller 08 

D - Packaging & Depackaging of ICs

• Package analysis and depackaging: plastic/ceramic, DIP, PGA, PQFP, surface mount, etc., + RGA and related issues; jet-etching; acoustic and x-ray radiography techniques, etc. - Dave Palmer 09 
• Deprocessing: nitride/oxide passivation, metal/oxide layer removal, wet/dry processes, X sections, surface/parallel polishing, etc. - Mike Strizich 10

DDD - Inspection/localization Techniques - 1

• Inspection: Optical techniques: basic optics plus IR, Nomarski, SOM, etc. - Larry Wagner 11 
• Inspection: SEM techniques: surface interaction physics, SE surface topography, backscatter, PVC, + basic VC.- Larry Wagner 12
• Internal die electrical testing: mechanical probing for DC parametrics (Vt, etc.) and basic e-beam testing.- Bob Rao 13

xxx - Analytical & Localization Techniques - 1 (3+2)

• Physical/surface analytical techniques: Auger, TEM, SIMS. - Charles Barbour 14 
• Localization: Light (photon) emission: basics, commercial systems, spectral signatures, Near -IR, etc. - Gary Shade 15 
• Thermal Localization: liquid crystal, IR, FMI, etc - Dan Barton 16
• Focused ion beam systems: precision cross sections, device mods, VC, probe points deposition, etc. - Ann Campbell 17
• Dry etch - Loren Hahn 18

zz- Business & Analysis - in the middle of the course

• Construction Analysis and Reverse Engineering - Mark Masters 19
• Customer Perspective - some comments - Gerald Servais 20

E- Inspection/localization Techniques - 2

• Scanning Probe Microscope localization: basic, MFM/CCI, electro-optic, etc.- Pai Tang-Yung-Yong 21 
• SEM & Electron Beam: EBIC, RCI, CIVA, LECIVA, etc. - Ed Cole 22
• Optical Probe Techniques: Scanning Optical Microscope: OBIC, LIVA, etc. - Ed Cole 23

BBB - Failure Analysis - Grab Bag - & the Future 2+3 or 3+2

• Failure Analysis Information Management: knowledge-based FA, expert systems, signature analysis, paperless labs, reports, etc. - Chris Henderson 24
• MEMS: Microelectromechanical Systems: Reliability and Failure Analysis - Danelle Tanner and Ken Peterson  25  was C
• A Specific Case History: walk through the process, emphasis on decision-making, perspective, intelligence - Steve Ferrier 26
• Electrical Over-Stress and Electrostatic Discharge Failures - Ian Morgan 27  
• FA & Diagnosis Future: needs, challenges, design for FA, etc. - interactive, using a challenge or two and have students brainstorm approaches or solutions.- Larry Wagner 29 - possibly elsewhere

  1998 / 37 Hrs. 30 Min. / 30 Video Tapes List Price US$5000.00 NTSC Order No. HV7024-QIA, NTSC ISBN 0-7803-4585-1 

The proposed structure above has been produced by Julian Noad, Amar Gharbi and Hugh Reekie.
Further details about the plans for the Ottawa presentation are available.
Note -  the suffix number, e.g. 08, above, are IEEE lecture sequence numbers.

Ted Dellin - Program Manager of Reliability Programs at Sandia National Labs. This includes program management of the Electronics Quality/Reliability Center, which works with many semiconductor manufacturers and vendors in reliability and failure analysis. He has orgamzed the development of the 1997 Sematech Reliability Roadmap and patticipated in the 1997 SIA National Technology Roadmap For Semiconductors.
David P. Vallett - The 1997 chair of the SEMATECH Product Analysis Forum. He joined IBM in Burlington, VT in 1982 as a CMOS product character~ation engineer and in the past six years has sened as manager and team leader of failure analysis technology development. His professional interests are in fault localization techniques and the impact of technology scaling on failure analysis.
Steve D. Hersee. A Professor in the EECE department of the University of New Mexico; has taught microelectronics processing since 1992. He has worked for major semiconductor corporations in Europe and the USA for 22 years prior to joining the university.
Kenneth M. Butler - A Senior Member of the Technical Staff of Texas Instruments in the ASIC Software Engineering Senices Division. He works with design groups in TI's Semiconductor Group in design for testability, automatic test pattern generation, automated failure diagnosis, and automated tester program generation. He has taught test tutorials inside TI and externally for ISTFA.
Doug Josephson - A high speed microprocessor designer with Hewlett Packard's Systems Technology Division in Fort Collins, Colorado.  Team leader for the design, test, and characterization of five HP PA-RISC microprocessors used in Hewlett Packard servers and workstations.
Charles F. Hawkins - A Professor in the EECE Dept. at the University of New Mexico. His research has been in testability, defect based testing, reliability, and failure analysis. He was General Chair of International Test Conference in 1996 and Program Chair in 1993; he co - Trned several Conference Best Paper Awards in CMOS IC test. He also teaches short courses for industry in design, test, and reliability.
Bill Miller - Manager of the Sandia Labs Reliability Physics Dept. He performs fundamental research in metals, oxides and MEMS. Many contributions to oxide wearout understanding.
Dave Palmer - Manager of the IC Packaging Group at Sandia Labs. He has taught several courses at UNM and is active in the Components, Packaging, Manufi~cturing Technology Society of the IEEE.
Michael P. Strizich - President of Analytical Solutions in Albuquerque, NM; peforms device analysis, including in-depth electrical characterization, reverse engineering, process evaluation, and failure analysis of complex semiconductor devices. Mike started his career in the Failure Analysis Group at National Semiconductor in Santa Clara, CA.
Larry Wagner - Member of Texas Instruments staff - with diverse and depth experience in failure analysis and teaching in-house courses on this subject. He was General Chairman of ISTFA in 1995 and is a member of the Sematech Product AcTivities Forum (PAF) . He is writing a book on failure analysis.
Bob Roa - Member of the Intel Technical Staff - with pioneer experience with e-beam technology at Cambridge University, particularly with respect to lithography applications. He serves on several ISTFA committees.
Charles Barbour - Senior member of the Sandia Labs technical staff - specializes in Surface Chemistry. He has co-authored 2 books, has published widely, and has given several university lectures on these subjects.
Gary Shade - Manager, Failure Analysis Dept., Ford Microelectronics, Colorado Springs, Colorado. The 1994 General Chair of the International Symposium on Test and Failure Analysis (ISTFA). He has diverse skills in failure analysis and in depth knowledge of light emission phenomena in IC defects. Dan Barton He is a senior member of the Sandia Labs technical staff in the Failure Analysis Dept. who works in Fluorescent MicroThermal Imaging. He was a winner of an R&D 100 award.
Ann Campbell - 1998 General Chair of the Reliability Physics Symposium. She is a Senior Staff Member of the Sandia Labs Failure Analysis Dept. Her interests lie in development of focus ion beam applications for IC failure analysis.
Loren Hahn - Member of IBM Failure Analysis Dept. in Essex Junction, Vermont. He specializes in e-beam applications.
Mark Master - Member of IBM Failure Analysis Dept. in Essex Junction, Vermont. He has diverse failure analysis skills and specializes in construction analysis and reverse engineering.
Gerald E. Servais - Staff Research Engineer, Delco Electronics - Supervisor of Digital Parts Engineering Group and for the last 6 years supervisor of the Parts Research & Test Development Group at Delco. One of founders of the CDF Automotive Electronics Council - developing automotive standards for the qualification of integrated circuits, discrete semiconductor devices, and passive components.
Pai Tangyunyong - Senior member of the Sandia Labs technical staff - works with atomic force microscopy and Fluorescent MicroThermal Imaging.
Ed Cole - The 1996 General Chair of the International Symposium on Test and Failure Analysis (ISTFA). He works with the Sandia National Labs Failure Analysis Dept. He has won several conference Best Paper awards and is the recipient of an R&D 100 Award in 1995. He is the developer of the CIVA, LECIVA, and LIVA FA techniques.
Chris Henderson - Senior member of the Sandia Labs technical staff, Failure Analysis Dept. - works with applying expert system technology to failure analysis. He was a wimner of an R&D 100 award.
Danelle Tanner - Senior member of the Sandia Labs technical staff - works with MEMS reliability model development. She has also worked in IC oxide wearout failure mechanisms.
Ken Peterson - A senior member of the Sandia Labs technical staff - he works in MEMS and MCM failure analysis.
Steve Ferrier - A senior member of the Hewlett Packard Failure Analysis Dept. in Corvallis, Oregon. In 1997, he won the Best Paper Award at ISTFA for his work on thermal modeling.
Ian Morgan - Member of the AMD Corp. Technical Staff - specializing in EOS/ESD. HE has taught many inhouse courses for AMD on these subjects and especially how failure analysis is linked to root cause determination.
Dick Ross - Manager of the IBM Failure Analysis Dept. in Essex Junction, Vermont - sponsor of the Sematech Product Activities Forum (PAF). He is frequently sought as a panelist and industry representative for failure analysis concerns.
Sudhakar Kudva - A Q&R Manager at Intel in Folsum, California. He was the first Chairman of the Sematech Product Analysis forum (PAF) that was begun to stimulate R&D initiatives in failure analysis.