IEEE Ottawa Section
Video Course on Microelectronic Failure Analysis
Last updated 18 Sep 2000 -a re-run of the CMOS sessions starts 26 Sep 2000

During the Fall Semester of 1997, thirty 75-minute lectures in Microelectronic Failure Analysis were given at the University ofNew Mexico (UNM) and transmitted via satellite to manufacturing sites across the USA; it is now available on videotape through the IEEE. The course was designed and delivered by experienced, recognized persons who are leaders in failure analysis practice, development, and conference leadership. This produces a depth and breadth of coverage that a single person could not do. Experts from industry conceived the course not only to fill a void in university teaching of failure analysis but also to allow strong participation.These lectures were a part of a graduate course: a joint venture ofthe UNM, Sandia National Labs, and the Product Analysis Forum (PAF) of Sematech. Many of the listed speakers also give tutorials atthe ATM-sponsored ISTFA (International Symposium for Testing and Failure Analysis); this is the pre-eminent annual conference formicroelectronics failure analysis.

Managers and practicing engineers within failure analysis departments will benefit greatly from this extensive course. Viewers should have a basic knowledge of transistor devices(MOSFET) and IC technology. A background in IC manufacturing is helpful, but not essential. This set consists of all thirty lectures on videotape, presentation notes. The textbookis Microelectronic Faiure Analysis Desk Reference, - The 4thEdition is now available 450pp; about $150US.

• Technical Foundations of Failure Analysis
• Etching: wet, dry, Focused Ion Beam analysis
• Imaging: optical, e-beam, Transmission Electron Microscopy, Electron- & Optical-Beam Induced Current thermal, & backside measurement
• Recent Techniques: Charge Induced Voltage Alteration, RCI, leakage currents - IDDt
• Management and Business of Failure Analysis

From this video you will learn

• The technical foundations of failure analysis: test, reliability, design impact, packaging, and fabrication
• Selection of etch and delayering techniques
• How to select one of the many imaging techniques
• New techniques, used by leading edge companies, for analysis of deep submicron ICs having up to seven layers of metal

K - "Micro" Processing for Circuit Analysis - Tuesday 26 September 2000, 9 am

• Focused ion beam systems: precision cross sections, device mods, VC, probe points deposition, etc. - Ann Campbell 17
• Dry etch - Loren Hahn 18 € 26 slides 13 pages

D - Reliability of CMOS ICs and Designing for Failure Analysis - Tuesday 3 October 2000, 9am

• CMOS IC Design: design and electrical aspects; design for diagnosis and FA. - Doug Josephson 05 € 39 slides 20 pages 
• CMOS IC Quality and Reliability: sources of failure yield, reliability, field, etc.;  why FA approach depends on source - Steve Hersee and Chuck Hawkins 06 € plus 30 mins of #07. 65 slides 33 pages (with #7)

M - Techniques for Defect Localization - 2 - Tuesday 10 October 2000, 9am 

• SEM & Electron Beam: EBIC, RCI, CIVA, LECIVA, etc. - Ed Cole 22
• Optical Probe Techniques: Scanning Optical Microscope: OBIC, LIVA, etc. - Ed Cole 23

There are no plans to re-run most of the series, but the video on "ReverseEngineering" may be run in November, on a Tuesday evening.
Note -  the suffixnumber, e.g. 08, above, are IEEE lecture sequence numbers; the notesare in this order.

Chipworks,3685 Richmond Road ( previously a Computing Devices building). Opposite Best Western Motel, see signs to Nortel and Chipworks. Follow signs, park and proceed to main entrance. The conference room is close by. Courtesy Ray Haythornthwaite.

• $84 per 3 session of 2 videos each ($66 if IEE/IEEE member) - includes notes in a binder if registered by 20 Sept
• No charge for the re-runs, for previous registrants who missed for any reason.
• To register pse fill in the form, advise course co-ordinator by email, and mail in your fee.

  Space is limited - first come first served. No guarantee of access for "no registration, just show" people

Steve D.Hersee.A Professor in the EECE department of the University of New Mexico; has taught microelectronics processing since 1992. He has worked for major semiconductor corporations in Europe and the USA for 22 years prior to joining the university.
Doug Josephson - A high speed microprocessor designer with Hewlett Packard's Systems Technology Division in Fort Collins,Colorado.  Team leader for the design, test, and characterization of five HP PA-RISC microprocessors used in Hewlett Packard servers and workstations.
Charles F.Hawkins - A Professor in the EECE Dept. at the University of New Mexico. Hisresearch has been in testability, defect based testing, reliability, and failure analysis. He was General Chair of International Test Conference in 1996 and Program Chair in 1993; he co - authored several Conference Best Paper Awards in CMOS IC test. He also teaches short courses for industry in design, test, and reliability.
Ann Campbell- 1998 General Chair of the Reliability Physics Symposium. She is a Senior Staff Member of the Sandia Labs Failure Analysis Dept. Her interests lie in development of focus ion beam applications for IC failure analysis.
Loren Hahn- Member of IBM Failure Analysis Dept.in Essex Junction, Vermont. He specializes in e-beam applications.
PaiTangyunyong - Senior member of the Sandia Labs technical staff - works with atomic force microscopy and Fluorescent Micro Thermal Imaging.
EdCole - The 1996 General Chair of the International Symposium on Test and Failure Analysis (ISTFA). He works with the Sandia National Labs Failure Analysis Dept. He has won several conference Best Paper awards and is the recipient of an R&D 100 Award in 1995. He is the developer of the CIVA, LECIVA, and LIVA FA techniques.